iProGadgets Repair Tools YCS-H03 Mini Fixture Mobile Phone Motherboard Chip BGA Clamp Multi-function Glue Removal BGA Soldering Adjustable PCB Clamp

Features:

• Larger size, more clamping space, fully applicable to various types of chips/motherboards
• Removal of tin and glue, no need to adjust the direction, travel coaxial movement
• For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife
• Motherboard cleaning doesn't require adjusting the orientation, clean up at once
• The module is suitable for various sizes of motherboards in all aspects

Package includes:
1 x Fixture